The resistors can also be laser trimmed to give high tolerance or actively trimmed, in-circuit, to give precise circuit performance.
Packaged, discrete, or naked components can then be assembled to provide very high levels of integration with good power dissipation. The populated substrate can then be integrated into a metal package to provide a highly robust and reliable electronic system.
We provide the complete solution comprising substrate, printing, chip and wire assembly, packaging test and reliability screening.
We have over 20 years of experience in the design and building of thick film hybrid products.
We have provided solutions for high-reliability applications in these sectors:
