Thick film hybrids are circuits formed on alumina substrates with fine line screen printed interconnect and resistor structures. These can be multi-layer with conductive vias providing very high density substrates.

The resistors can also be laser trimmed to give high tolerance or actively trimmed, in-circuit, to give precise circuit performance.

Packaged, discrete, or naked components can then be assembled to provide very high levels of integration with good power dissipation. The populated substrate can then be integrated into a metal package to provide a highly robust and reliable electronic system.